The Compute Module 3+ enables you to embed Raspberry Pi functionality into your industrial design. The Compute Module 3+ follows on from the launch of the Pi 3+ to reflect the recent updates to the thermal design and processor package.
The Compute Module CM3+ is a prototyping platform aimed at business and industrial users.
The CM3+ has the same core and features the Broadcom BCM2837B0 SoC from the Raspberry Pi 3 Model B+. The Pi Compute Module is smaller and can be integrated into designs. The module is based on the SODIMM standard so you can use standard connectors and embed into systems and other products.
All modules are CE and FCC compliant.
The Raspberry Pi CM3+ will remain in production until at least January 2024.
Compute Module 3+ Specifications
Memory: 1GB LPDDR2 SDRAM
Processor: Broadcom BCM2837B0, Cortex-A53 64-bit SoC @ 1.2GHz
Multimedia: H.264, MPEG-4 decode (1080p30), H.264 encode (1080p30), OpenGL ES 1.1, 2.0 graphics
Operating System: NOOBS_3_0_0 (16th November 2018) or later
Board Dimensions: 67.6mm x 31.1mm x 3.7mm (highest component)
Board Weight: 9 grams
|Shipping weight:||0,01 Kg|
|Product weight:||0,01 Kg|
|Dimensions ( length × width × height ):||6,76 × 3,11 × 0,37 cm|