Soldering tin1,0mm Sn95Ag4Cu1 250g (lead-free)
• Halide activated
• developed to cope with the higher process temperatures at lead-free soldering
• very low spitting of flux
• with micro doted alloys for the low solder tip consumption
• High activity, good spread and high residue reliability
• Flux residues - can be left on the PCB
• Hand and robot soldering
• Electronic and Electrical industry
Flux Type (IEC 61190-1-3 REM1): 1.2.2.B
Flux Content (EN 12224): 3%
Corrosive Effects (DIN 8516): None
Alloy (FLOTWIN TSC): Sn95Ag4Cu1/713
Flux Core: 1 Core
• developed to cope with the higher process temperatures at lead-free soldering
• very low spitting of flux
• with micro doted alloys for the low solder tip consumption
• High activity, good spread and high residue reliability
• Flux residues - can be left on the PCB
• Hand and robot soldering
• Electronic and Electrical industry
Flux Type (IEC 61190-1-3 REM1): 1.2.2.B
Flux Content (EN 12224): 3%
Corrosive Effects (DIN 8516): None
Alloy (FLOTWIN TSC): Sn95Ag4Cu1/713
Flux Core: 1 Core
| Shipping weight: | 0,28 Kg |
