soldering tin 0,5mm Sn95,5Ag3,8Cu0,7 250g (lead-free)
• Halide activated
• developed to cope with the higher process temperatures at lead-free soldering
• very low spitting of flux
• with micro doted alloys for the low solder tip consumption
• High activity, good spread and high residue reliability
• Flux residues - can be left on the PCB
• Hand and robot soldering
• Electronic and Electrical industry
Flux Type (IEC 61190-1-3 REM1): 1.1.3
Flux Content (EN 12224): 3,5%
Corrosive Effects (DIN 8516): None
Alloy (TSC Ecoloy): Sn95,5Ag3,8Cu0,7 100g
Flux Core: 1 Core
likewise illustration
• developed to cope with the higher process temperatures at lead-free soldering
• very low spitting of flux
• with micro doted alloys for the low solder tip consumption
• High activity, good spread and high residue reliability
• Flux residues - can be left on the PCB
• Hand and robot soldering
• Electronic and Electrical industry
Flux Type (IEC 61190-1-3 REM1): 1.1.3
Flux Content (EN 12224): 3,5%
Corrosive Effects (DIN 8516): None
Alloy (TSC Ecoloy): Sn95,5Ag3,8Cu0,7 100g
Flux Core: 1 Core
likewise illustration
